03.04.2013 b3b -445-tl 1 of 4 b3b - 445 - tl technical data led, 3 mm algainp b3b - 445- tl is a algainp led mounted on a lead frame with a clear epoxy lens. on forward bias it emits a band of orange light with a peak at 630 nm. specifications (unit: mm) ? structure: algainp ? peak w avelength: typ. 630 nm ? optical output power: typ. 7 cd ? package: 3 mm clear epoxy absolute maximum ratings (t a =25c) item symbol value unit power dissipation p d 125 mw forward current i f 50 ma pulse forward current * 1 i fp 100 ma reverse vo ltage v r 5 v operating temperature t opr - 40 ? +85 c storage temperature t stg - 40 ? + 8 5 c soldering temperature *2 t sol 260 c * 1 1/10 duty cycle @ 1 khz *2 1.6mm from body, must be completed within 3 seconds electro - optical characteristics item symbol condition min. typ. max. unit forward voltage v f i f = 20 ma - 2.2 2.7 v reverse current i r v r = 5 v - - 10 a luminous intensity i v i f = 20 ma 4.9 7.0 - cd peak wavelength p i f = 20 ma - 630 - nm dominant wavelength d i f = 20 ma - 625 - nm s pectrum radiation bandwidth ? i f = 20 ma - 2 0 - nm viewing angle * 2 1/2 i f = 20 ma - 15 - deg. * tolerance: - 10 / +5 deg. notes ? do not view directly into the emitting area of the led during operat ion! ? the above specifications are for reference purpose only and subjected to change without prior notice.
03.04.2013 b3b -445-tl 2 of 4 typical performance curves forward current ? forward voltage luminous intensity ? forward current luminous intensity ? ambient temperatur e max. forward current ? ambient temperature peak wavelength radiation diagram
03.04.2013 b3b -445-tl 3 of 4 precaution for use 1. cautions ? do not look directly into the emitted light or look through the optical system. to prevent in adequate exposure of the radiation, wear protective glasses. 2. lead forming ? when forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. do not use the base of the lead frame as a fulcrum during lead forming. ? lead forming should be done before soldering. ? do not a pply any bending stress to the base of the lead. the stress to the base may damage the led?s characteristics or it may break the leds. ? when mounted the leds onto the printed circuit board, the holes on the circuit board should be exactly aligned with the l eads of leds. if the leds are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the leds. recommended land layout (unit: mm) 3. soldering conditions ? solder the leds no closer than 3 mm from the base of the lead. ? do not apply any stress to the lead particularly when heat. ? the leds must not be reposition after soldering. ? after soldering the leds, the lead should be protected from mechanical shock or vibration until the leds return to room temperature. ? when it is necess ary to clamp the leds to prevent soldering failure, it is important to minimize the mechanical stress on the leds. ? cut the led leads at room temperature. cutting the leads at high temperature may cause the failure of the leds.
03.04.2013 b3b -445-tl 4 of 4 soldering conditions 4. sta tic electricity ? the leds are very sensitive to static electricity and surge voltage. so it is recommended that a wrist band or an anti - electrostatic glove be used when handling the leds. ? all devices, equipment and machinery must be grounded properly. it is recommended that precautions should be taken against surge voltage to the equipment that mounts the leds.
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